COB & GOB & MINI LED Display Technology

COB: Chip on board.

COB is Chip on board, which is a different chip encapsulation technology, all chips directly integrated packaged on the special PCB board, while what we said encapsulation tech is putting three RGB led chips to integrate inside an SMD electronics package to produce the individual SMD diodes.

Advantages and disadvantages: 
1, High protection for LEDs.
2, LED Colour non-uniformity.  
    COB has a risky during the process of wavelength and color splitting and picking for all chips on the boards, which make it difficult to get perfect color uniformity for whole display.
3, The maintenance for COB is also a problem waiting to be solved.
4,  Gap bewteen module connection.

GOB: Glue on borad.

GOB is Glue on board to get high protection led display, which is an analogy as module encapsulation. It is working on the whole display module, by using a patented transparent glue covering the surface of module’s PCB board already with thousands SMD lamps soldered on it, finally the module getting the special shield on its surface.

Advantages and disadvantages: 
1, High protection for LEDs.
2, The maintenance for GOB is also hard to solved.
3,  light reflection because of glue water covered.
4, Gap between modules due to glue water.